機器外形尺寸?Dimension

980 * 1100 * 1780mm

運動行程(X*Y *Z/C)Travel Range

500 *650 *80/80mm

產(chǎn)品最大尺寸Product Max .Size

200 *300/200 *300mm

運動控制方式Motion Control Mode

微型工控機(IPC)

驅(qū)動方式 Drive Mode

伺服馬達(dá)/伺服絲桿 Servo r Motor/Ball Screw

機器軸數(shù)Number of Axis

6 Axes

激光功率范圍Laser Power Range

0-300W

最大移動速度Travel Maximum

1000mm/s

電源最大功耗Max Power Consumption

185-265V/1500W

電源平均功耗Average Power Consumption

450W

重復(fù)定位精度Repeat Position Accuracy

±0 .02mm

錫絲范圍Diameter of Solder Wire

0.3-2.0mm

錫粉直徑Solder Powder Particle size

5-150um (Type1-Type6)

總重量Weight

700Kg

激光光源種類LaserType

半導(dǎo)體 Semiconductor Laser

最小焊接間距Minimum Soldering Distance

0.2mm

工作環(huán)境Work Environment

0-40℃不凝結(jié)  濕度10%-90%